Intel CPU with Optical OCI Chiplet Demoed with 4Tbps of Bandwidth and 100M Reach
Intel unveiled a new CPU with an Optical Compute Interconnect chiplet, offering 4Tbps bandwidth and 100m reach. The chiplet merges Photonic and Electronic Integrated Circuits, featuring built-in lasers for improved server communication, especially in AI servers. Intel plans to scale the technology up to 32Tbps, focusing on power savings and enhanced bandwidth. This advancement aligns with the industry's move towards co-packaged optics for better efficiency and performance, marking a significant shift in server architecture towards power efficiency and high-speed data transfer.
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Intel showcased a new CPU integrated with an Optical Compute Interconnect (OCI) chiplet, boasting 4Tbps of bandwidth and a 100m reach. The chiplet combines a Photonic Integrated Circuit (PIC) and Electronic Integrated Circuit (EIC) with built-in lasers, aiming to streamline communication within servers, particularly AI servers. By incorporating on-package optics, Intel anticipates significant power savings and enhanced bandwidth capabilities. The company plans to scale the interconnect technology from 2Tbps to 32Tbps in future iterations. Intel's focus on integrating the light source onto the chiplet marks a significant advancement in optical interconnect technology. This innovation aligns with the industry trend towards co-packaged optics for improved efficiency and performance. Intel's roadmap includes collaboration with customers to further develop and integrate this technology into upcoming products. The move towards optical interconnects on chip signifies a notable shift in server architecture design, emphasizing power efficiency and high-speed data transfer capabilities.
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