A closer look at Intel and AMD's different approaches to gluing together CPUs

Intel and AMD have adopted different strategies for their latest CPU architectures, focusing on multi-die designs to overcome limitations in traditional monolithic chip designs. AMD's 5th-Gen Epyc processors utilize a chiplet architecture with up to 16 core complex dies (CCDs) surrounding a central I/O die, allowing for higher yields and shared silicon between Epyc and Ryzen processors. This design enables flexible scaling of core counts and memory bandwidth, although it may introduce higher latencies for certain workloads. In contrast, Intel's Xeon 6 processors have transitioned to a heterogeneous architecture, featuring a combination of compute and I/O dies. Intel's approach involves fewer, larger compute dies, which can lead to lower yield rates but potentially lower access latencies due to integrated memory controllers. Both companies are exploring future enhancements, with Intel's Clearwater Forest expected to utilize more chiplets for improved performance, while AMD may increase core counts or package sizes in its next-generation Epyc processors. The competition between Intel and AMD continues to evolve as they adapt their designs to meet the demands of modern computing.

- AMD's Epyc processors use a chiplet architecture for higher yields and flexibility.

- Intel's Xeon processors have shifted to a heterogeneous design with integrated memory controllers.

- Both companies face challenges related to die size, yield rates, and latency.

- Future developments may include more chiplets for Intel and increased core counts for AMD.

- The competition between Intel and AMD is driving innovation in CPU architecture.