Ultrasonic Chips Could Cut Interference in the IoT

Researchers in Japan have developed a novel ultrasonic circuit designed to reduce interference among the increasing number of Internet of Things (IoT) devices. As the number of connected devices is projected to reach nearly 30 billion by 2030, the challenge of managing communication across various wireless standards becomes critical. Traditional smartphones require multiple filters to eliminate unwanted signals, which can be bulky and expensive. The new technology integrates these filters onto a single chip, significantly minimizing space requirements. This ultrasonic circuit utilizes surface acoustic wave (SAW) filters, which convert radio frequency signals into mechanical waves, allowing for compact design. The researchers employed acoustic topological structures to guide ultrasonic waves, preventing backscattering that can degrade signal quality. This innovative approach enables the propagation of signals in one direction, even around sharp bends. The initial prototype chip is expected to be about one square centimeter, with plans to reduce its size further. Future iterations aim to enhance functionality by allowing dynamic control of ultrasound signals. If commercialized, this technology could revolutionize smartphone design and improve user experience by freeing up space for other components.

- Researchers in Japan have created an ultrasonic circuit to reduce IoT device interference.

- The technology integrates multiple filters onto a single chip, saving space in smartphones.

- It utilizes surface acoustic wave filters to convert signals, allowing for compact designs.

- The circuit prevents backscattering, ensuring high-quality signal propagation.

- Future developments aim to enhance functionality and potentially revolutionize smartphone design.