DARPA slaps down credit card for 3D military chiplets $840M ought to be enough?
DARPA awarded $840 million to TIE at the University of Texas-Austin for 3DHI technology to enhance military systems like radar and UAVs. The $1.4 billion project involves industry partnerships for defense innovation.
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DARPA has awarded $840 million to the Texas Institute for Electronics (TIE) at the University of Texas-Austin to develop next-generation semiconductor microsystems for the U.S. military. TIE will focus on 3D heterogeneous integration (3DHI) technology, stacking layers of silicon dies on top of each other to create complete chips. The project, part of DARPA's Next Generation Microelectronics Manufacturing (NGMM) program, aims to enhance defense systems like radar and unmanned aerial vehicles with higher performance and lower power consumption. The five-year initiative will involve creating a manufacturing center to produce 3DHI microsystem prototypes for the Department of Defense, with industry partners including AMD, Intel, and Micron. The total project budget is $1.4 billion, with $840 million from DARPA and $552 million from Texas. This effort seeks to leverage chiplet technology already used in consumer electronics to advance military applications.
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