JEDEC Plans LPDDR6-Based CAMM, DDR5 MRDIMM Specifications
JEDEC is developing DDR5 MRDIMM standards for servers, aiming to double peak bandwidth and support more than two ranks. Micron introduced the first DDR5 MRDIMMs for Intel's Xeon 6 servers. LPDDR6 CAMMs will feature wider memory buses and new connector arrays.
Read original articleJEDEC is developing standards for DDR5 Multiplexed Rank DIMMs (MRDIMM) for servers and an updated LPCAMM standard for next-generation LPDDR6 memory. Micron recently introduced the industry's first DDR5 MRDIMMs, set to launch with Intel's Xeon 6 server platforms. MRDIMMs use DDR5 components but introduce multiplexing for improved performance and increased memory module capacity. The standard aims to double peak bandwidth to 12.8 Gbps and support more than two ranks. Additionally, a "Tall MRDIMM" form factor is in development to enable higher capacity DIMMs using commodity DRAM chips. On the other hand, LPDDR6 CAMMs will feature wider memory buses and new connector arrays to accommodate the memory type's advancements. JEDEC is targeting a 24-bit subchannel/48-bit channel design for LPDDR6 CAMMs. While MRDIMMs are already shipping for Intel systems, the completion timeline for both memory module standards is not specified.
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