Samsung mass produces ' thinnest' LPDDR5X

Samsung has commenced mass production of the world's thinnest LPDDR5X DRAM packages, which are available in 12 GB and 16 GB capacities. These new packages measure approximately 0.65 mm in thickness, making them 0.06 mm thinner than standard LPDDR5X modules. The innovative design incorporates a 4-stack structure and utilizes advanced packaging techniques, including optimized printed circuit boards and epoxy molding compounds. This reduction in thickness enhances airflow within smartphones, significantly improving thermal management, which is essential for devices with high-performance processors and advanced AI capabilities. The new LPDDR5X packages also boast a 21.2% improvement in heat resistance compared to previous generations. Samsung's Executive Vice President, YongCheol Bae, emphasized the company's commitment to innovation in the low-power DRAM market. Looking ahead, Samsung plans to expand its LPDDR5X offerings, with intentions to develop 6-layer 24 GB and 8-layer 36 GB modules, although the thickness of these future products has not yet been disclosed. The introduction of these thinner DRAM packages is expected to contribute to the trend of slimmer smartphones, although they are not the sole factor in achieving this goal.

- Samsung has begun mass production of 0.65 mm LPDDR5X DRAM packages.

- The new packages are 9% thinner and improve heat resistance by 21.2%.

- Enhanced thermal management is crucial for high-performance smartphones.

- Future developments include 6-layer 24 GB and 8-layer 36 GB modules.

- Thinner DRAM packages may lead to slimmer smartphone designs.