8-Bit CPU Formed on Single Grain Glass Substrate (2002)
Sharp Corporation and Semiconductor Energy Laboratory Co., Ltd. achieved a breakthrough by integrating an 8-bit Z80 CPU onto a glass substrate for LCD displays, enabling smaller, lighter, and more reliable digital systems. This innovation opens doors for ultra-thin "sheet computers" and "sheet TVs," with mass production already underway for mobile devices.
Read original article
Sharp Corporation and Semiconductor Energy Laboratory Co., Ltd. have achieved a world first by integrating an 8-bit Z80 CPU onto a glass substrate designed for LCD displays using CG-Silicon technology. This breakthrough allows for digital logic components to be formed on the same glass substrate as an LCD display, leading to reductions in component size, external parts, weight, and thickness, while enhancing system reliability. The advancement in crystallinity of CG-Silicon and innovative process technology enabled the integration of functional peripheral components and data processing circuitry on the glass substrate. This milestone paves the way for the development of ultra-thin "sheet computers" and "sheet TVs." Sharp has already begun mass production of System LCDs for mobile devices, with both companies focusing on further innovations to create full-fledged systems-on-a-panel for the evolving "ubiquitous network" environment.
Related
TSMC experimenting with rectangular wafers vs. round for more chips per wafer
TSMC is developing an advanced chip packaging method to address AI-driven demand for computing power. Intel and Samsung are also exploring similar approaches to boost semiconductor capabilities amid the AI boom.
Intel CPU with Optical OCI Chiplet Demoed with 4Tbps of Bandwidth and 100M Reach
Intel unveiled a new CPU with an Optical Compute Interconnect chiplet, offering 4Tbps bandwidth and 100m reach. The chiplet merges Photonic and Electronic Integrated Circuits, featuring built-in lasers for improved server communication, especially in AI servers. Intel plans to scale the technology up to 32Tbps, focusing on power savings and enhanced bandwidth. This advancement aligns with the industry's move towards co-packaged optics for better efficiency and performance, marking a significant shift in server architecture towards power efficiency and high-speed data transfer.
Extreme Measures Needed to Scale Chips
Semiconductor technology faces challenges in scaling for AI demands. Innovations like EUV lithography and chip stacking are key. Japanese researchers explore linear accelerators for EUV light. Attracting young talent is crucial.
Powerful laser miniaturized from tabletop to microchip
Researchers have miniaturized a powerful laser onto a microchip, enabling integration into various technologies. The sapphire-based platform creates tiny, efficient devices with high-performance laser light, potentially revolutionizing photonics fields.
Scientists discover way to 'grow' sub-nanometer sized transistors
Scientists at the Institute for Basic Science developed a method to grow sub-nanometer transistors, enabling precise control of electron movement. This breakthrough in semiconductor technology promises high-performance electronic devices.
2 commentsRelated
TSMC experimenting with rectangular wafers vs. round for more chips per wafer
TSMC is developing an advanced chip packaging method to address AI-driven demand for computing power. Intel and Samsung are also exploring similar approaches to boost semiconductor capabilities amid the AI boom.
Intel CPU with Optical OCI Chiplet Demoed with 4Tbps of Bandwidth and 100M Reach
Intel unveiled a new CPU with an Optical Compute Interconnect chiplet, offering 4Tbps bandwidth and 100m reach. The chiplet merges Photonic and Electronic Integrated Circuits, featuring built-in lasers for improved server communication, especially in AI servers. Intel plans to scale the technology up to 32Tbps, focusing on power savings and enhanced bandwidth. This advancement aligns with the industry's move towards co-packaged optics for better efficiency and performance, marking a significant shift in server architecture towards power efficiency and high-speed data transfer.
Extreme Measures Needed to Scale Chips
Semiconductor technology faces challenges in scaling for AI demands. Innovations like EUV lithography and chip stacking are key. Japanese researchers explore linear accelerators for EUV light. Attracting young talent is crucial.
Powerful laser miniaturized from tabletop to microchip
Researchers have miniaturized a powerful laser onto a microchip, enabling integration into various technologies. The sapphire-based platform creates tiny, efficient devices with high-performance laser light, potentially revolutionizing photonics fields.
Scientists discover way to 'grow' sub-nanometer sized transistors
Scientists at the Institute for Basic Science developed a method to grow sub-nanometer transistors, enabling precise control of electron movement. This breakthrough in semiconductor technology promises high-performance electronic devices.