X-Rays Image Transistors in 3D
An upgraded X-ray imaging technique, burst ptychography, achieves 4-nanometer resolution for non-destructive 3D imaging of semiconductor chips, improving defect identification and supporting the complexity of modern chip designs.
Read original article
An upgraded X-ray imaging technique has been developed that allows for high-resolution, 3D imaging of semiconductor chips, revealing intricate details of their designs and flaws without causing damage. This method, known as burst ptychography, achieves a resolution of 4 nanometers, significantly improving upon the previous 19-nanometer resolution of its predecessor, ptychographic X-ray laminography (PyXL). The technique utilizes high-energy X-rays from a synchrotron to penetrate the entire chip, enabling engineers to visualize the arrangement of transistors and interconnects in three dimensions. This advancement is crucial as modern chips become increasingly complex, with features that are no longer planar. The ability to inspect chips non-destructively allows for faster identification of manufacturing defects and better alignment between design and actual production. The researchers, including those from the Paul Scherrer Institute and the University of Southern California, believe that further improvements could lead to resolutions as fine as 1 nanometer. This technique is expected to enhance the efficiency of semiconductor manufacturing processes, which are vital for the ongoing miniaturization and performance enhancement of electronic devices.
- A new X-ray imaging technique provides 3D views of semiconductor chips at 4-nanometer resolution.
- The method allows for non-destructive inspection of chips, revealing designs and flaws.
- Burst ptychography improves upon previous imaging techniques, facilitating faster defect identification.
- The advancement is critical as semiconductor features become more complex and 3D in nature.
- Researchers aim to further enhance the resolution, potentially reaching 1 nanometer in the future.
Related
Extreme Measures Needed to Scale Chips
Semiconductor technology faces challenges in scaling for AI demands. Innovations like EUV lithography and chip stacking are key. Japanese researchers explore linear accelerators for EUV light. Attracting young talent is crucial.
Extreme Measures Needed to Scale Chips
The July 2024 IEEE Spectrum issue discusses scaling compute power for AI, exploring solutions like EUV lithography, linear accelerators, and chip stacking. Industry innovates to overcome challenges and inspire talent.
Scientists discover way to 'grow' sub-nanometer sized transistors
Scientists at the Institute for Basic Science developed a method to grow sub-nanometer transistors, enabling precise control of electron movement. This breakthrough in semiconductor technology promises high-performance electronic devices.
X-Ray Upgrade Can See Transistors in 3D
An upgraded X-ray imaging technique called burst ptychography achieves 4-nanometer resolution, enabling non-destructive 3D imaging of semiconductor chips, enhancing quality control and defect identification in manufacturing processes.
X-Rays Image Transistors in 3D
An upgraded X-ray imaging technique, burst ptychography, achieves 4-nanometer resolution for 3D imaging of semiconductor chips, enhancing defect analysis and quality control in manufacturing, with potential for 1-nanometer resolution.
0 commentsRelated
Extreme Measures Needed to Scale Chips
Semiconductor technology faces challenges in scaling for AI demands. Innovations like EUV lithography and chip stacking are key. Japanese researchers explore linear accelerators for EUV light. Attracting young talent is crucial.
Extreme Measures Needed to Scale Chips
The July 2024 IEEE Spectrum issue discusses scaling compute power for AI, exploring solutions like EUV lithography, linear accelerators, and chip stacking. Industry innovates to overcome challenges and inspire talent.
Scientists discover way to 'grow' sub-nanometer sized transistors
Scientists at the Institute for Basic Science developed a method to grow sub-nanometer transistors, enabling precise control of electron movement. This breakthrough in semiconductor technology promises high-performance electronic devices.
X-Ray Upgrade Can See Transistors in 3D
An upgraded X-ray imaging technique called burst ptychography achieves 4-nanometer resolution, enabling non-destructive 3D imaging of semiconductor chips, enhancing quality control and defect identification in manufacturing processes.
X-Rays Image Transistors in 3D
An upgraded X-ray imaging technique, burst ptychography, achieves 4-nanometer resolution for 3D imaging of semiconductor chips, enhancing defect analysis and quality control in manufacturing, with potential for 1-nanometer resolution.